New Analysis from Global Industry Analysts Reveals Steady Growth for Integrated Passive Devices, with the Market to Reach $1.7 Billion Worldwide by 2026 – PR Newswire

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Edition: 10; Released: May 2022
Executive Pool: 752
Companies: 39 – Players covered include 3D Glass Solutions, Inc.; 3DiS Technologies; Global Communication Semiconductors, LLC; Infineon Technologies AG; Johanson Technology, Inc.; Koa Speer Electronics, Inc.; M/A-Com Technology Solutions Holdings, Inc. (Macom); ON Semiconductor Corporation; OnChip Devices, Inc.; Qorvo, Inc.; Skyworks Solutions, Inc.; STATS ChipPAC Pte., Ltd.; STMicroelectronics; TDK Corporation; Viking Technologes; Wavenics, Inc.; Xpeedic Technology, Inc. and Others.
Coverage: All major geographies and key segments
Segments: Material (Silicon, Glass, Other Materials); Wireless Technology (WLAN, Cellular, GPS, Bluetooth, Other Wireless Technologies); Application (EMS & EMI Protection, RF IPD, LED Lighting, Other Applications); End-Use (Consumer Electronics, Automotive, Communications, Aerospace & Defense, Other End-Uses)
Geographies: World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

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Amid the COVID-19 crisis, the global market for Integrated Passive Devices estimated at US$1.2 Billion in the year 2022, is projected to reach a revised size of US$1.7 Billion by 2026, growing at a CAGR of 6.7% over the analysis period. Silicon, one of the segments analyzed in the report, is projected to grow at a 6.5% CAGR, while growth in the Glass segment is readjusted to a revised 7.6% CAGR. Integrated passive devices (IPDs) are also called embedded passive components or integrated passive components. These are electrical components encompassing capacitors, resistors, inductors, chokes or coils, baluns, impedance matching components or any combinations embedded inside the same package or similar substrate. . the passive components are formed between dielectric layers and the same substrate. The basic forms of IPDs are resistor-capacitor, resistor, capacitor or resistor-capacitor-coil inductor …….



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